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High Precision AuSn Alloy Plating Service

Mitsuya Co., Ltd.
High Precision AuSn Alloy Plating Service
AuSn plating on a wafer

AuSn plating on a wafer

Solder suitable for high-temperature, high-strength, and high-reliability connections

Gold-Tin Alloy offers the advantage of being lead-free while having remarkable attributes, emerging as a versatile solution tailored for connector applications. Boasting reliability even in high-temperature conditions, it offers solderability without flux, and an exceptional thermal conductivity for efficient heat dissipation. Its low coefficient of thermal expansion mitigates deformation risks, while excellent wettability and oxidation resistance ensure enduring performance.

Mitsuya employs advanced plating techniques to apply Gold-Tin Alloy onto various surfaces, ensuring precise deposition and adherence. From aerospace to electronics, Gold-Tin Alloy stands as a beacon of innovation, guiding the way to enhance reliability and efficiency in industrial landscapes.

Mitsuya has experience dealing with countries worldwide, including Europe, the United States, and Asia. Domestically, we complete 66,569 projects annually, with 630 repeat customers. Leveraging our strengths in high quality, diverse product range (approximately 90 types), and technical expertise, we accommodate orders from small lots of one unit to large volumes of up to 10,000,000 units, as well as small-quantity, multi-variety orders.

Mitsuya's AuSn differential thermal analysis results

Mitsuya's AuSn differential thermal analysis results

Uniform thickness and composition alloy plating

Mitsuya's Gold-Tin (AuSn) Alloy Plating, with a wide variety of compositions, achieves a plating film thickness tolerance of ±2μm, meeting stringent requirements. Our AuSn Alloy plating is suitable for parts requiring high-temperature or high-reliability connections, particularly crucial in advanced technology applications like data communications, high-power electronics, and cutting-edge equipment.

Specifically, our AuSn Alloy Plating finds applications in sensors, semiconductor ICs, wafers, and optical electronic parts. We offer thinner plating deposits compared to sheet or ribbon materials and can precisely apply plating to select areas (partial/selective plating). Additionally, we provide both eutectic and non-eutectic compositions of AuSn Alloy Plating.
Safe for the environment and humans

Safe for the environment and humans

Solder safe for both environment and humans

In response to the growing demand for environmentally friendly solutions, AuSn Alloy Plating is compliant with Restriction of Hazardous Substances (RoHS) regulations, ensuring it is not harmful to the environment. Lead-free solders reduce contamination of the soil, water, and air in the ecosystem. Additionally, lead-free solders are not only safe for the environment but also for humans. Since lead is a toxic substance posing health risks to people working with it, lead-free solders are a safer alternative for human health.
Mitsuya has quality certifications.

Mitsuya has quality certifications.

High productivity with dependable quality

Mitsuya has long developed and mass-produced AuSn alloy plating. Initially, AuSn alloy plating was limited to rack plating, which imposed constraints on lot size and part shape. However, we have now developed barrel plating capabilities, allowing for high-volume plating of small parts in single batches. Additionally, we have implemented a dedicated robotic line for this technology. This fully automated line significantly enhances productivity and enables us to meet global customer demands effectively.

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