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Japan-Made Diamond Composite Heat Sinks for AI/Data Center CPUs and GPUs

TECNISCO, LTD.
Silver Diamond-Enhanced Cold Plate for AI & Data Center Cooling

Silver Diamond-Enhanced Cold Plate for AI & Data Center Cooling

Beyond Copper for AI/Data Center Cooling with TECNISCO’s Silver Diamond

TECNISCO’s Silver Diamond, combined with skived-fin processing,
is used in cooling systems for AI and data center applications.

High-performance GPUs and CPUs generate tremendous amounts of heat,
making efficient heat dissipation essential for maintaining long-term performance and reliability.

In a skived-fin cooling structure, water flows through finely machined fins to efficiently remove heat
and maintain the device at an appropriate operating temperature.

This cold plate has traditionally been made from copper,with a thermal conductivity of 400 W/m·K.
TECNISCO’s Silver Diamond offers up to 1,000 W/m·K, enabling more efficient heat dissipation than copper
and supporting the cooling demands of next-generation AI and data center systems.

If you are looking to improve cooling performance or upgrade your existing thermal materials, please contact us with your specifications or requirements.
We look forward to supporting your development.

Property Comparison of Three Diamond Composite Materials

Property Comparison of Three Diamond Composite Materials

Diamond Composite Material Lineup
(Silver Diamond, CVD Diamond, Copper Diamond)

TECNISCO offers three types of diamond composite materials. Silver Diamond has a low CTE of 6.1 ppm/K, closely matching that of GaN and GaAs, which helps improve reliability by reducing thermal stress. For applications prioritizing thermal conductivity, CVD Diamond offers the highest value at 1,500 W/m·K. While Silver Diamond and CVD Diamond are uniform materials, Copper Diamond allows customized diamond distribution. As next-generation products become more powerful, thermal management becomes increasingly important. Our diamond materials offer advanced thermal solutions, with proven use in satellite applications demonstrating their high reliability.
Silver Diamond Processing Flow Example

Silver Diamond Processing Flow Example

Processing Options for Silver Diamond

Here are some examples of additional processing options available for our original Silver Diamond material. In addition to material development and manufacturing, TECNISCO also offers advanced processing capabilities, allowing us to provide both the material and subsequent processing as an integrated solution. For example, a thick Cu layer can be formed on the Silver Diamond and polished to create a surface suitable for bonding. In addition, skived fins can be formed on the Cu layer, enabling an integrated structure combining Silver Diamond and cooling fins.
What TECNISCO offers for thermal management

What TECNISCO offers for thermal management

Thermal Management Challenges for High-Power Devices ?
TECNISCO Silver Diamond offers 1,000 W/m·K Thermal Conductivity

As semiconductor devices become more powerful, thermal management is increasingly critical. In AI and data centers, heat generated by high-performance CPUs and GPUs is a major challenge. High-power devices such as GaN-based chips also require efficient heat dissipation.

TECNISCO combines our proprietary Silver Diamond material, offering thermal conductivity of up to 1,000 W/m·K, with precision processing technologies to provide advanced thermal management solutions.

Based on your desired specifications and thermal requirements, we propose the optimal material and processing method. From prototyping to mass production, we support your needs starting from just 1 piece.

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