Cross Edge® Technology: Japan’s Microfabrication Advancing the Next Generation
TECNISCO, LTD.
Cross Edge® Technology and Applicable Processes
Flexibly combining multiple processing technologies to solve challenges.
Cross Edge® Technology integrates five advanced processes: cutting, grinding, polishing, metallization, and bonding. With an integrated One Stop Solution, TECNISCO achieves stable quality, quick turnaround, and outstanding cost efficiency, providing speedy solutions to customers’ challenges. We accelerate solutions for your toughest engineering challenges, supporting the technologies that enrich society, including data centers, AI, and high speed communications.
Thermal Properties of Heat Sink Materials
High Thermal Conductivity (≥925 W/m·K) and CTE (6.1 ppm/K) Heat Sink Materials.
We offer heatsinks by machining AlN, Cu, CuW, and our proprietary diamond based material with applied metal films. Our Silver Diamond, for example, achieves ≥925 W/mK thermal conductivity and a 6.1 ppm/K CTE, dramatically reducing thermal stress in semiconductor devices.
Typical uses include industrial equipment for welding and cutting, as well as semiconductor and medical lasers. Demand is growing in automotive and data center markets. It has flight heritage in high-power amplifiers for communication satellites.
Typical uses include industrial equipment for welding and cutting, as well as semiconductor and medical lasers. Demand is growing in automotive and data center markets. It has flight heritage in high-power amplifiers for communication satellites.
One Stop TGV Solution from Drilling to Metal Filling
Our glass components leverage a wide selection of glass substrates and are processed in a fully integrated flow from drilling to metal filling. Via materials for Through Glass Vias (TGV) can be selected to match your required properties, and we offer via-top metallization for 3D stacking and device miniaturization.
These products serve GPUs and CPUs, critical automotive parts like LiDAR, and components for MEMS and medical devices. Our fine TGV processing is a prime demonstration of the power of Cross Edge® Technology.
These products serve GPUs and CPUs, critical automotive parts like LiDAR, and components for MEMS and medical devices. Our fine TGV processing is a prime demonstration of the power of Cross Edge® Technology.
Providing solutions that perfectly fit your needs
Exceptional value, realized by speed and cost efficiency
From initial consultation and quotation to prototyping, final product delivery, and after-sales support, we propose optimal specifications that balance uncompromising quality with cost-effectiveness throughout the entire project lifecycle. Our proprietary Cross Edge® Technology is utilized to its full potential within this integrated process.
We foster a corporate culture where every employee is constantly challenged to pursue innovative solutions. By consistently providing first-class products and services through our unique Cross Edge® Technology, we act as a true solution partner, committed to resolving your complex requests and bringing your ambitious concepts to life.
We foster a corporate culture where every employee is constantly challenged to pursue innovative solutions. By consistently providing first-class products and services through our unique Cross Edge® Technology, we act as a true solution partner, committed to resolving your complex requests and bringing your ambitious concepts to life.
- URL (Japanese):https://www.tecnisco.com/
- URL (English):https://www.tecnisco.com/en/